XCKU3P-L1FFVB676I
IC FPGA 280 I/O 676FCBGAManufacturer: AMD
Categories: FPGAs (Field Programmable Gate Array)
Quality Control: Learn More
AMD Kintex® UltraScale+™ XCKU3P-L1FFVB676I FPGA. This device features 355,950 logic elements and 20,340 LABs/CLBs, with 31,641,600 total RAM bits. It offers 280 configurable I/O pins and operates from a supply voltage of 0.698V to 0.876V. The XCKU3P-L1FFVB676I is housed in a 676-FCBGA (27x27) package and supports a junction temperature range of -40°C to 100°C. This FPGA is suitable for applications in aerospace, defense, data center, and high-performance computing sectors.
Additional Information
Series: Kintex® UltraScale+™RoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 676-BBGA, FCBGA |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Voltage - Supply | 0.698V ~ 0.876V |
| Number of Logic Elements/Cells | 355950 |
| Supplier Device Package | 676-FCBGA (27x27) |
| Number of LABs/CLBs | 20340 |
| Total RAM Bits | 31641600 |
| Number of I/O | 280 |
| Programmable | Not Verified |
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