XCKU3P-2FFVD900E
IC FPGA 304 I/O 900FCBGAManufacturer: AMD
Categories: FPGAs (Field Programmable Gate Array)
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AMD Kintex® UltraScale+™ XCKU3P-2FFVD900E Field Programmable Gate Array. This device features 355,950 logic elements and 20,340 LABs/CLBs, offering significant programmable logic capacity. It includes 31,641,600 RAM bits for on-chip data storage. The XCKU3P-2FFVD900E provides 304 user I/O pins, facilitating extensive connectivity. Designed for surface mount applications, it is supplied in a 900-FCBGA (31x31) package. The operating junction temperature range is 0°C to 100°C, and the supply voltage is between 0.825V and 0.876V. This FPGA is utilized across industries such as communications, data center, and industrial automation.
Additional Information
Series: Kintex® UltraScale+™RoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 900-BBGA, FCBGA |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Voltage - Supply | 0.825V ~ 0.876V |
| Number of Logic Elements/Cells | 355950 |
| Supplier Device Package | 900-FCBGA (31x31) |
| Number of LABs/CLBs | 20340 |
| Total RAM Bits | 31641600 |
| Number of I/O | 304 |
| Programmable | Not Verified |
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