AM27S03DCB
Standard SRAM, 16X4, 35ns, TTL, CDIP16Manufacturer: Advanced Micro Devices
Categories: SRAMs
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The Advanced Micro Devices AM27S03DCB is a standard SRAM component from the AM27S03 series, offering a memory organization of 16 words by 4 bits, resulting in a total density of 64 bits. This asynchronous memory device features a maximum access time of 35ns and operates with TTL technology. The component utilizes a 16-terminal Dual In-line Ceramic Glass-Sealed (CDIP16) package, identified by the JESD30 code R-GDIP-T16, with a terminal pitch of 2.54mm and a body width of 7.62mm. It supports a supply voltage range of 4.75V to 5.25V. Designed for parallel access with 3-state output characteristics, this component is suitable for applications in industrial control systems and telecommunications infrastructure.
Additional Information
Series: AM27S03RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 19.4310 |
| Width | 7.6200 |
| Technology | TTL |
| Access_Time_Max | 35.0000000000000000 |
| JESD_30_Code | R-GDIP-T16 |
| Memory_Density | 64.0000000000000000 |
| Memory_IC_Type | STANDARD SRAM |
| Memory_Organization | 16X4 |
| Memory_Width | 4 |
| Number_of_Functions | 1 |
| Number_of_Ports | 1 |
| Number_of_Terminals | 16 |
| Number_of_Words | 16.0000000000000000 |
| Number_of_Words_Code | 16 |
| Operating_Mode | Asynchronous |
| Operating_Temperature_Max | 75.0 |
| Operating_Temperature_Min | 0.0 |
| Output_Characteristics | 3-State |
| Output_Enable | No |
| Package_Body_Material | CERAMIC, GLASS-SEALED |
| Package_Code | DIP |
| Package_Equivalence_Code | DIP16,.3 |
| Package_Shape | Rectangular |
| Package_Style | IN-LINE |
| Parallel_Serial | Parallel |
| Seated_Height_Max | 5.0800 |
| Supply_Voltage_Max | 5.25000 |
| Supply_Voltage_Min | 4.75000 |
| Supply_Voltage_Nom | 5 |
| Surface_Mount | No |
| Terminal_Form | THROUGH-HOLE |
| Terminal_Pitch | 2.540 |
| Terminal_Position | Dual |
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