AM27PS185DMB
OTP ROM, 64KX8, 30ns, TTL, CDIP18Manufacturer: Advanced Micro Devices
Categories: OTP ROMs
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Advanced Micro Devices AM27PS185 series OTP ROM, part number AM27PS185DMB, offers a 64K x 8 memory organization with a 524,288-bit density. This asynchronous device features a maximum access time of 30ns and operates with TTL technology. The component is housed in an 18-lead Ceramic DIP package (JESD-30 Code: R-XDIP-T18) with through-hole termination. It supports a supply voltage range of 4.5V to 5.5V and operates across a wide temperature range from -55°C to +125°C. This device is suitable for applications requiring high-reliability, radiation-hardened memory solutions, often found in aerospace and defense systems. The AM27PS185DMB is designed with MIL-STD-883 Class B (Modified) screening.
Additional Information
Series: AM27PS185RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Technology | TTL |
| Access_Time_Max | 30.0000000000000000 |
| JESD_30_Code | R-XDIP-T18 |
| Memory_Density | 524288.0000000000000000 |
| Memory_IC_Type | OTP ROM |
| Memory_Organization | 64KX8 |
| Memory_Width | 8 |
| Number_of_Functions | 1 |
| Number_of_Terminals | 18 |
| Number_of_Words | 2048.0000000000000000 |
| Number_of_Words_Code | 64k |
| Operating_Mode | Asynchronous |
| Operating_Temperature_Max | 125.0 |
| Operating_Temperature_Min | -55.0 |
| Package_Body_Material | Ceramic |
| Package_Code | DIP |
| Package_Equivalence_Code | DIP18,.3 |
| Package_Shape | Rectangular |
| Package_Style | IN-LINE |
| Parallel_Serial | Parallel |
| Screening_Level_Reference_Standard | MIL-STD-883 Class B (Modified) |
| Supply_Current_Max | 150.000000000000000 |
| Supply_Voltage_Max | 5.50000 |
| Supply_Voltage_Min | 4.50000 |
| Supply_Voltage_Nom | 5 |
| Surface_Mount | No |
| Terminal_Form | THROUGH-HOLE |
| Terminal_Pitch | 2.540 |
| Terminal_Position | Dual |
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