5962-8779104VX
FIFO, 64X5, 65ns, Asynchronous, TTL, CDIP18Manufacturer: Advanced Micro Devices
Categories: FIFOs
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Advanced Micro Devices (AMD) 5962-8779104 is a 64 x 5 bit asynchronous FIFO memory device. This component offers a maximum access time of 65 ns and operates with a TTL compatible interface. The memory organization provides 64 words of 5 bits each, resulting in a total memory density of 320 bits. Packaged in an 18-lead Ceramic Dual In-line Package (CDIP) with through-hole termination, it is designed for operation across an extended temperature range of -55°C to +125°C. Key features include a totem pole output characteristic and a nominal supply voltage of 5V. This device is suitable for applications in defense and aerospace where high reliability and wide operating temperature ranges are critical.
Additional Information
Series: 5962-8779104RoHS Status: Manufacturer Lead Time: Product Status: DiscontinuedPackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 22.8600 |
| Width | 7.6200 |
| Technology | TTL |
| Access_Time_Max | 65.0000000000000000 |
| Cycle_Time | 100.0000000000000000 |
| JESD_30_Code | R-GDIP-T18 |
| Memory_Density | 320.0000000000000000 |
| Memory_Organization | 64X5 |
| Memory_Width | 5 |
| Number_of_Functions | 1 |
| Number_of_Terminals | 18 |
| Number_of_Words | 64.0000000000000000 |
| Number_of_Words_Code | 64 |
| Operating_Mode | Asynchronous |
| Operating_Temperature_Max | 125.0 |
| Operating_Temperature_Min | -55.0 |
| Output_Characteristics | Totem Pole |
| Output_Enable | No |
| Package_Body_Material | CERAMIC, GLASS-SEALED |
| Package_Code | DIP |
| Package_Shape | Rectangular |
| Package_Style | IN-LINE |
| Parallel_Serial | Parallel |
| Seated_Height_Max | 5.0800 |
| Supply_Voltage_Max | 5.50000 |
| Supply_Voltage_Min | 4.50000 |
| Supply_Voltage_Nom | 5 |
| Surface_Mount | No |
| Terminal_Form | THROUGH-HOLE |
| Terminal_Pitch | 2.540 |
| Terminal_Position | Dual |
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