XC3S50-4FGG900C
Field Programmable Gate Array, 192 CLBs, 50000 Gates, PBGA900Manufacturer: Advanced Micro Devices
Categories: Field Programmable Gate Arrays
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Advanced Micro Devices XC3S50 Field Programmable Gate Array (FPGA) with part number XC3S50-4FGG900C. This device features 192 CLBs and 50,000 equivalent gates, offering substantial logic capacity. The maximum combinatorial delay of a CLB is 0.610 ns. It operates within a temperature range of 0°C to 85°C and utilizes a supply voltage between 1.14V and 1.26V, with a nominal of 1.2V. The FPGA is housed in a 900-ball Plastic Ball Grid Array (PBGA) package (JESD-30 Code: S-PBGA-B900), with a terminal pitch of 1.00 mm and a square package shape measuring 31mm x 31mm. This component is suitable for applications in telecommunications, industrial control, and consumer electronics.
Additional Information
Series: XC3S50RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 31.0000 |
| Length | 31.0000 |
| Combinatorial_Delay_of_a_CLB_Max | 0.6100000000000000 |
| JESD_30_Code | S-PBGA-B900 |
| Number_of_CLBs | 192 |
| Number_of_Equivalent_Gates | 50000 |
| Number_of_Terminals | 900 |
| Operating_Temperature_Max | 85.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 192 CLBS, 50000 GATES |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA900,30X30,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 2.6000 |
| Supply_Voltage_Max | 1.26000 |
| Supply_Voltage_Min | 1.14000 |
| Supply_Voltage_Nom | 1.2 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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