XC3S50-4FGG676I
Field Programmable Gate Array, 192 CLBs, 50000 Gates, PBGA676Manufacturer: Advanced Micro Devices
Categories: Field Programmable Gate Arrays
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Advanced Micro Devices XC3S50-4FGG676I is a member of the XC3S50 Field Programmable Gate Array (FPGA) family. This device features 192 CLBs and an equivalent gate count of 50,000. It operates within a temperature range of -40°C to 100°C and requires a supply voltage between 1.14V and 1.26V, with a nominal value of 1.2V. The component is housed in a 676-pin Ball Grid Array (BGA) package, with a terminal pitch of 1.00mm. Its organization includes 192 CLBs and 50,000 gates. The XC3S50 series is often utilized in industrial, communications, and consumer electronics applications requiring flexible logic implementation. The combinatorial delay of a CLB is a maximum of 0.610 ns. The package style is a square grid array.
Additional Information
Series: XC3S50RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Width | 27.0000 |
| Length | 27.0000 |
| Combinatorial_Delay_of_a_CLB_Max | 0.6100000000000000 |
| JESD_30_Code | S-PBGA-B676 |
| Number_of_CLBs | 192 |
| Number_of_Equivalent_Gates | 50000 |
| Number_of_Terminals | 676 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 192 CLBS, 50000 GATES |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA676,26X26,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 2.6000 |
| Supply_Voltage_Max | 1.26000 |
| Supply_Voltage_Min | 1.14000 |
| Supply_Voltage_Nom | 1.2 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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