XC3S400-4FGG676I
Field Programmable Gate Array, 192 CLBs, 50000 Gates, PBGA676Manufacturer: Advanced Micro Devices
Categories: Field Programmable Gate Arrays
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Advanced Micro Devices XC3S400-4FGG676I is a Field Programmable Gate Array (FPGA) from the XC3S400 series. This device features 192 CLBs and an equivalent gate count of 50,000. It operates within an industrial temperature range of -40°C to +100°C and utilizes a supply voltage of 1.2V, with a maximum of 1.26V and a minimum of 1.14V. The combinatorial delay of a CLB is a maximum of 0.610 ns. This component is housed in a 676-ball, square Plastic Ball Grid Array (PBGA) package, measuring 27x27mm with a terminal pitch of 1.00mm. Its Ball Grid Array (BGA) package style is suitable for surface mounting. The XC3S400-4FGG676I finds application in various industries including industrial automation, consumer electronics, and telecommunications.
Additional Information
Series: XC3S400RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 27.0000 |
| Width | 27.0000 |
| Combinatorial_Delay_of_a_CLB_Max | 0.6100000000000000 |
| JESD_30_Code | S-PBGA-B676 |
| Number_of_CLBs | 192 |
| Number_of_Equivalent_Gates | 50000 |
| Number_of_Terminals | 676 |
| Operating_Temperature_Max | 100.0 |
| Operating_Temperature_Min | -40.0 |
| Organization | 192 CLBS, 50000 GATES |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA676,26X26,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 2.6000 |
| Supply_Voltage_Max | 1.26000 |
| Supply_Voltage_Min | 1.14000 |
| Supply_Voltage_Nom | 1.2 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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