XC3S200AN-5FGG676C
Field Programmable Gate Array, 448 CLBs, 200000 Gates, 770MHz, CMOS, PBGA676Manufacturer: Advanced Micro Devices
Categories: Field Programmable Gate Arrays
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The Advanced Micro Devices XC3S200AN-5FGG676C is a Field Programmable Gate Array (FPGA) from the XC3S200AN series. This CMOS device features 448 CLBs and offers approximately 200,000 equivalent gates, with a maximum clock frequency of 770 MHz. It operates within a supply voltage range of 1.14V to 1.26V, nominal at 1.2V, and has a maximum combinatorial delay of 4.36 ns per CLB. The XC3S200AN-5FGG676C is housed in a 676-ball BGA (S-PBGA-B676) package with a 1.00 mm terminal pitch and a square footprint of 27x27 mm. This FPGA is suitable for applications in consumer electronics, industrial automation, and telecommunications. The operating temperature range is from 0°C to 85°C.
Additional Information
Series: XC3S200ANRoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:Download Free CAD Model:
Technical Details:
| Length | 27.0000 |
| Width | 27.0000 |
| Technology | CMOS |
| Clock_Frequency_Max | 770.00000 |
| Combinatorial_Delay_of_a_CLB_Max | 4.3600000000000000 |
| JESD_30_Code | S-PBGA-B676 |
| Number_of_CLBs | 448 |
| Number_of_Equivalent_Gates | 200000 |
| Number_of_Inputs | 502 |
| Number_of_Outputs | 502 |
| Number_of_Terminals | 676 |
| Operating_Temperature_Max | 85.0 |
| Operating_Temperature_Min | 0.0 |
| Organization | 448 CLBS, 200000 GATES |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | BGA |
| Package_Equivalence_Code | BGA676,26X26,40 |
| Package_Shape | Square |
| Package_Style | GRID ARRAY |
| Programmable_Logic_Type | FIELD PROGRAMMABLE GATE ARRAY |
| Seated_Height_Max | 2.6000 |
| Supply_Voltage_Max | 1.26000 |
| Supply_Voltage_Min | 1.14000 |
| Supply_Voltage_Nom | 1.2 |
| Surface_Mount | Yes |
| Terminal_Form | Ball |
| Terminal_Pitch | 1.000 |
| Terminal_Position | Bottom |
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