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Field Programmable Gate Arrays

XC3S200AN-4FGG676I

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XC3S200AN-4FGG676I

Field Programmable Gate Array, 448 CLBs, 200000 Gates, 667MHz, CMOS, PBGA676

Manufacturer: Advanced Micro Devices

Categories: Field Programmable Gate Arrays

Quality Control: Learn More

The Advanced Micro Devices XC3S200AN-4FGG676I is a Field Programmable Gate Array (FPGA) from the XC3S200AN series. This device features 448 Logic Cells (CLBs) and an equivalent gate count of 200,000. It operates at a maximum clock frequency of 667MHz and utilizes CMOS technology. The component is housed in a 676-ball Plastic Ball Grid Array (PBGA) package with a terminal pitch of 1.00mm, a body size of 27x27mm, and a maximum seated height of 2.6mm. It supports a supply voltage range of 1.14V to 1.26V nominal 1.2V. The operating temperature range is -40°C to +100°C. This FPGA is suitable for applications in the industrial, automotive, and communications sectors.

Additional Information

Series: XC3S200ANRoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: ActivePackaging: Datasheet:
Technical Details:
Width27.0000
TechnologyCMOS
Length27.0000
Clock_Frequency_Max667.00000
Combinatorial_Delay_of_a_CLB_Max4.8800000000000000
JESD_30_CodeS-PBGA-B676
Number_of_CLBs448
Number_of_Equivalent_Gates200000
Number_of_Inputs502
Number_of_Outputs502
Number_of_Terminals676
Operating_Temperature_Max100.0
Operating_Temperature_Min-40.0
Organization448 CLBS, 200000 GATES
Package_Body_MaterialPLASTIC/EPOXY
Package_CodeBGA
Package_Equivalence_CodeBGA676,26X26,40
Package_ShapeSquare
Package_StyleGRID ARRAY
Programmable_Logic_TypeFIELD PROGRAMMABLE GATE ARRAY
Seated_Height_Max2.6000
Supply_Voltage_Max1.26000
Supply_Voltage_Min1.14000
Supply_Voltage_Nom1.2
Surface_MountYes
Terminal_FormBall
Terminal_Pitch1.000
Terminal_PositionBottom

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