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Field Programmable Gate Arrays

XC3S200AN-4FG676I

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XC3S200AN-4FG676I

Field Programmable Gate Array, 448 CLBs, 200000 Gates, 667MHz, CMOS, PBGA676

Manufacturer: Advanced Micro Devices

Categories: Field Programmable Gate Arrays

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The Advanced Micro Devices XC3S200AN-4FG676I is a Field Programmable Gate Array (FPGA) fabricated using advanced CMOS technology. This component features 448 Logic Cells (CLBs) and an equivalent gate count of 200,000, offering substantial logic density for complex designs. It operates at a maximum clock frequency of 667 MHz, facilitating high-speed data processing. The device is housed in a 676-terminal Ball Grid Array (BGA) package, specifically a S-PBGA-B676, with a terminal pitch of 1.00 mm. Its operating temperature range is from -40°C to +100°C, making it suitable for demanding environments. The supply voltage operates within a nominal 1.2V range. Applications for this FPGA span various industries, including telecommunications, industrial automation, and consumer electronics.

Additional Information

Series: XC3S200ANRoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: Datasheet:
Technical Details:
Width27.0000
TechnologyCMOS
Length27.0000
Clock_Frequency_Max667.00000
Combinatorial_Delay_of_a_CLB_Max4.8800000000000000
JESD_30_CodeS-PBGA-B676
Number_of_CLBs448
Number_of_Equivalent_Gates200000
Number_of_Inputs502
Number_of_Outputs502
Number_of_Terminals676
Operating_Temperature_Max100.0
Operating_Temperature_Min-40.0
Organization448 CLBS, 200000 GATES
Package_Body_MaterialPLASTIC/EPOXY
Package_CodeBGA
Package_Equivalence_CodeBGA676,26X26,40
Package_ShapeSquare
Package_StyleGRID ARRAY
Programmable_Logic_TypeFIELD PROGRAMMABLE GATE ARRAY
Seated_Height_Max2.6000
Supply_Voltage_Max1.26000
Supply_Voltage_Min1.14000
Supply_Voltage_Nom1.2
Surface_MountYes
Terminal_FormBall
Terminal_Pitch1.000
Terminal_PositionBottom

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