MP2-H030-51P1-S-TG30
CONN HEADER FUTUREBUS+ 30POS PCBManufacturer: 3M
Categories: Specialized
Quality Control: Learn More
The 3M MetPak™ MP2 series connector, part number MP2-H030-51P1-S-TG30, is a high-density 30-position Futurebus+® compliant header designed for backplane applications. This through-hole mounted component features male pins with a 0.079" (2.00mm) pitch and a robust 30.0µin (0.76µm) gold contact finish for reliable signal integrity. The beige header is equipped with board and mating guides to facilitate accurate assembly and ensuring proper alignment in dense electronic systems. Its press-fit termination method offers a solderless connection, suitable for demanding environments. This component finds application in telecommunications, networking infrastructure, and high-performance computing systems where robust and reliable interconnects are critical.
Additional Information
Series: MetPak™ MP2RoHS Status: RoHS Compliant By ExemptionManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: TubeDatasheet:Download Free CAD Model:
Technical Details:
| Features | Board Guide, Mating Guide |
| Packaging | Tube |
| Connector Type | Header, Male Pins |
| Contact Finish | Gold |
| Color | Beige |
| Mounting Type | Through Hole |
| Number of Positions | 30 |
| Pitch | 0.079"" (2.00mm) |
| Number of Rows | 5 |
| Number of Positions Loaded | All |
| Termination | Press-Fit |
| Connector Usage | Backplane |
| Connector Style | Futurebus+® |
| Contact Finish Thickness | 30.0µin (0.76µm) |
| Contact Layout, Typical | - |
| Number of Columns | - |
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