HSHM-H055B-CES50080-TG30L
CONN HEADER 55POS 2MM PRESS-FITManufacturer: 3M
Categories: Hard Metric, Standard
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3M MetPak™ HSHM Series HSHM-H055B-CES50080-TG30L is a 55-position, 2mm pitch male pin header designed for high-density backplane applications. This press-fit connector features gold contact plating with a thickness of 30.0µin (0.76µm) for enhanced conductivity and durability. The header is engineered with a through-hole mounting type and a robust male pin configuration. Its 5-row design and 2mm pitch facilitate efficient board space utilization. This component is suitable for demanding industries such as telecommunications, networking, and industrial automation where reliable and high-performance interconnect solutions are critical.
Additional Information
Series: MetPak™ HSHMRoHS Status: RoHS CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: BulkDownload Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Connector Type | Header, Male Pins |
| Contact Finish | Gold |
| Mounting Type | Through Hole |
| Number of Positions | 55 |
| Pitch | 0.079"" (2.00mm) |
| Number of Rows | 5 |
| Number of Positions Loaded | All |
| Termination | Press-Fit |
| Connector Usage | Backplane |
| Connector Style | B 11 |
| Contact Finish Thickness | 30.0µin (0.76µm) |
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