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MT62F768M32D2DS-023 FAAT:B

LPDDR5 24GBIT 32 315/315 TFBGA 2

Manufacturer:

$25.65

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The MT62F768M32D2DS-023 FAAT:B by Micron Technology Inc. represents a cutting-edge memory solution designed to meet the rigorous demands of automotive applications. As a part of Micron’s Automotive, AEC-Q100 series, this device is engineered to ensure reliability and performance in environments requiring extended temperature ranges. Here are its core features:

– **Manufactured by Micron Technology Inc.:** A global leader in memory and storage solutions, ensuring high-quality and reliability.
– **Memory Category: Automotive AEC-Q100 series:** Specifically designed to meet the stringent requirements of automotive industry standards.
– **Package / Case:** Comes in a 200-WFBGA (Ball Grid Array) package, with dimensions of 10×14.5mm, suitable for compact and robust designs.
– **Mounting Type:** Designed for surface mount applications, facilitating ease of integration in modern electronic assemblies.
– **Operating Temperature Range:** Capable of operating in extreme conditions, ranging from -40°C to 105°C, making it ideal for use in harsh automotive environments.
– **Supplier Device Package:** The product is supplied in a 200-WFBGA package, enhancing performance and reliability in applications.
– **Part Status:** This component is currently active, indicating availability and ongoing support.

Typical industries and applications that benefit from the use of the MT62F768M32D2DS-023 FAAT:B include:
– Automotive electronics
– Advanced driver-assistance systems (ADAS)
– In-vehicle infotainment systems
– Automotive safety and control systems

The provision of high-density, reliable memory in a compact and durable package makes this Micron Technology Inc. product an exemplary choice for designers and engineers looking to develop the next generation of automotive applications.

Additional information

Additional Information

Series: Automotive, AEC-Q100
RoHS Status: unknown
Manufacturer Lead Time: 26 week(s)
Product Status: Active
Packaging: Box

Datasheet:

Not Available

Download Free CAD Model:

Technical Details:
PackagingBox
Package / Case200-WFBGA
Mounting TypeSurface Mount
Memory Size24Gbit
Memory TypeVolatile
Operating Temperature-40°C ~ 105°C
Voltage - Supply-
TechnologySDRAM - Mobile LPDDR5
Clock Frequency4.266 GHz
Memory FormatDRAM
Supplier Device Package200-WFBGA (10x14.5)
Part StatusActive
Write Cycle Time - Word, Page-
Memory InterfaceParallel
Memory Organization768M x 32
ProgrammableNot Verified
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