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MT62F512M32D2DS-031 AAT:B





Manufactured by Micron Technology Inc., the MT62F512M32D2DS-031 AAT:B is a high-performance memory component distinguished by its compliance with the stringent standards of the Automotive, AEC-Q100 series, ensuring reliability in harsh environments. This product is encapsulated in a 200-WFBGA (10×14.5) package, optimized for surface mount technology, making it suitable for streamlined assembly processes in manufacturing. It operates across a wide temperature range of -40°C to 105°C, catering to applications that demand high thermal stability.

Designed for use in automotive systems which require durable and reliable memory solutions, the MT62F512M32D2DS-031 AAT:B meets the rigorous operational demands of this industry while also being suitable for a broad spectrum of other applications that operate under extreme conditions. This memory component is shipped in box packaging, ensuring product integrity during transportation.

With an active part status, this memory module from Micron’s reputed portfolio is engineered for longevity and consistency, reinforcing the high-quality standards Micron Technology Inc. is known for. The 200-WFBGA supplier device package is designed to offer compact and efficient integration into system designs, making it a favored choice among professionals looking for memory solutions that combine performance with reliability.

Additional information

Additional Information

Series: Automotive, AEC-Q100
RoHS Status: unknown
Manufacturer Lead Time: 4 week(s)
Product Status: Active
Packaging: Box


Not Available

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Technical Details:
Package / Case200-WFBGA
Mounting TypeSurface Mount
Memory Size16Gbit
Memory TypeVolatile
Operating Temperature-40°C ~ 105°C
Voltage - Supply-
TechnologySDRAM - Mobile LPDDR5
Clock Frequency3.2 GHz
Memory FormatDRAM
Supplier Device Package200-WFBGA (10x14.5)
Part StatusActive
Write Cycle Time - Word, Page-
Memory InterfaceParallel
Memory Organization512M x 32
ProgrammableNot Verified
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