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MT62F1G32D2DS-023 AAT:B TR





The MT62F1G32D2DS-023 AAT:B TR from Micron Technology Inc. represents a pinnacle of memory technology designed to meet the rigorous standards of automotive applications, fully compliant with the AEC-Q100 series specifications. This high-performance memory device is presented in a 200-WFBGA package, perfectly suited for surface-mount technology, thereby streamlining the manufacturing process and ensuring reliability even in tight PCB layouts.

Offering a substantial storage capacity, this memory component operates within an extended temperature range of -40°C to 105°C, guaranteeing reliability and functionality in the demanding environments typically encountered in the automotive industry. Its package, a compact 200-WFBGA (10×14.5), is optimized for robust performance and minimized space usage on the circuit board, making it an ideal choice for advanced driver-assistance systems (ADAS), in-vehicle infotainment systems, and other automotive electronic applications.

The device comes packaged on Tape & Reel (TR), facilitating efficient handling and placement during the assembly process, significantly benefiting high-volume production requirements. Its status as an active component ensures ongoing support and availability, making it a trustworthy choice for long-term projects and designs.

In summary, the MT62F1G32D2DS-023 AAT:B TR memory component by Micron Technology Inc. blends high-capacity storage with the durability and reliability required for automotive applications, packaged in an efficient form factor that supports the latest in vehicle technology advancements.

Additional information

Additional Information

Series: Automotive, AEC-Q100
RoHS Status: unknown
Manufacturer Lead Time: 6 week(s)
Product Status: Active
Packaging: Tape & Reel (TR)


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Technical Details:
PackagingTape & Reel (TR)
Package / Case200-WFBGA
Mounting TypeSurface Mount
Memory Size32Gbit
Memory TypeVolatile
Operating Temperature-40°C ~ 105°C
Voltage - Supply1.05V
TechnologySDRAM - Mobile LPDDR5
Clock Frequency3.2 GHz
Memory FormatDRAM
Supplier Device Package200-WFBGA (10x14.5)
Part StatusActive
Write Cycle Time - Word, Page-
Memory InterfaceParallel
Memory Organization1G x 32
ProgrammableNot Verified
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