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MT53E256M32D2DS-046 AAT:B





The MT53E256M32D2DS-046 AAT:B by Micron Technology Inc. is a cutting-edge memory module designed for high-reliability applications, conforming to the rigorous standards of the Automotive, AEC-Q100 series. This flagship component features a dense 200-WFBGA (10×14.5) package, leveraging the robustness of its construction to ensure superior performance in extreme conditions. With an operating temperature range of -40°C to 105°C (TC), it is ideally suited for environments that demand uncompromising thermal resilience.

This module offers a surface mount mounting type, facilitating seamless integration into an array of automotive systems, which increasingly rely on advanced memory capabilities for enhanced functionality and performance. The encapsulation in a 200-WFBGA package ensures a compact footprint while providing the reliable connectivity essential for today’s sophisticated automotive electronics.

As a part of Micron Technology Inc.’s commitment to supporting advancements in automotive technologies, the MT53E256M32D2DS-046 AAT:B is positioned as a critical component for systems requiring high-grade memory solutions. The current status of this part as “Last Time Buy” indicates the urgency for purchasers to secure inventory for their future manufacturing needs, acknowledging this component’s pivotal role in the continued development and maintenance of automotive systems.

The integration of this memory module extends beyond the automotive industry, aligning with various applications that require the durability and reliability offered by an AEC-Q100 compliant component. Its robust design and expansive memory capacity ensure it meets the stringent requirements of multiple high-reliability sectors.

Additional information

Additional Information

Series: Automotive, AEC-Q100
RoHS Status: ROHS3 Compliant
Manufacturer Lead Time: 6 week(s)
Product Status: Last Time Buy
Packaging: Tray


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Technical Details:
Package / Case200-WFBGA
Mounting TypeSurface Mount
Memory Size8Gbit
Memory TypeVolatile
Operating Temperature-40°C ~ 105°C (TC)
Voltage - Supply1.1V
TechnologySDRAM - Mobile LPDDR4
Clock Frequency2.133 GHz
Memory FormatDRAM
Supplier Device Package200-WFBGA (10x14.5)
Part StatusLast Time Buy
Write Cycle Time - Word, Page-
Memory Interface-
Memory Organization256M x 32
ProgrammableNot Verified
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