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MT29VZZZCDAFQKWL-046 W.G0L

UMCP 2112G

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$119.57

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The MT29VZZZCDAFQKWL-046 W.G0L is a high-performance, surface mount memory component manufactured by Micron Technology Inc. This device comes packaged in a 254-BGA (Ball Grid Array), ensuring a secure and reliable connection to the printed circuit board. The compact 254-TFBGA (Thin Fine Pitch Ball Grid Array) package is designed to minimize space on the hardware, making it an ideal choice for applications where real estate is at a premium.

With an operating temperature range of -25°C to 85°C, this memory chip is engineered to function reliably in environments experiencing moderate thermal variances, making it suitable for a wide array of industrial applications. The memory module is designed to meet the rigorous demands of various sectors, prominently in advanced computing systems, telecommunications, and automotive electronics, where performance and durability are paramount.

The part status of ‘Active’ indicates that Micron Technology continues to support this memory module, ensuring availability and technical assistance for integration into new projects or existing systems requiring upgrades or maintenance.

This memory module exemplifies Micron Technology’s commitment to providing cutting-edge memory solutions that are synonymous with quality, reliability, and performance. Although the series is not specified, the part number MT29VZZZCDAFQKWL-046 W.G0L itself assures the buyer of receiving a product that meets the meticulous standards expected from components produced by a leader in the memory sector.

Additional information

Additional Information

Series:
RoHS Status: unknown
Manufacturer Lead Time: No lead time information available
Product Status: Active
Packaging: Box

Datasheet:

Not Available

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Technical Details:
PackagingBox
Package / Case254-BGA
Mounting TypeSurface Mount
Memory Size2Tbit (NAND), 64Gbit (LPDDR4X)
Memory TypeNon-Volatile, Volatile
Operating Temperature-25°C ~ 85°C
Voltage - Supply-
TechnologyFLASH - NAND, DRAM - LPDDR4X
Clock Frequency2.133 GHz
Memory FormatFLASH, RAM
Supplier Device Package254-TFBGA
Part StatusActive
Write Cycle Time - Word, Page-
Memory InterfaceUFS2.1
Memory Organization256G x 8 (NAND), 2G x 32 (LPDDR4X)
ProgrammableNot Verified
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