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MT29F512G08EBLEEJ4-R:E TR

TLC 512G 64GX8 VBGA

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$10.73

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The MT29F512G08EBLEEJ4-R:E TR by Micron Technology Inc. represents a state-of-the-art addition to the memory category, crafted for high-performance applications requiring robust data storage solutions. As an active component, it is meticulously engineered to meet the demanding needs of a broad range of industries including telecommunications, computing, automotive, and industrial automation.

This memory chip is housed in a 132-VBGA (Ball Grid Array) package, optimized for surface mount technology (SMT) applications, ensuring a minimal footprint on PCBs (Printed Circuit Boards) while providing reliable connections. The packaging method, Tape & Reel (TR), is designed for efficient assembly in high-volume production environments, supporting automated pick-and-place operations.

Key features include:
– Package / Case: 132-VBGA, conforming to the 12×18 package size for compact yet powerful designs.
– Mounting Type: Surface Mount, facilitating streamlined integration into a wide array of circuit designs.
– Operating Temperature Range: 0°C ~ 70°C, ensuring reliability and performance across a spectrum of environmental conditions.
– Supplier Device Package: 132-VBGA (12×18), indicative of Micron Technology Inc.’s commitment to delivering cutting-edge technology in efficient, industry-standard formats.

Micron’s MT29F512G08EBLEEJ4-R:E TR memory component is pivotal for developers aiming to advance their systems’ capabilities while maintaining efficiency and reliability. Whether for enhancing data communication speed in networking equipment, increasing the processing power of computing systems, or driving more sophisticated functionalities in automotive electronics, this memory chip stands as a foundational element for next-generation technological innovations.

Additional information

Additional Information

Series:
RoHS Status: unknown
Manufacturer Lead Time: 7 week(s)
Product Status: Active
Packaging: Tape & Reel (TR)

Datasheet:

Not Available

Download Free CAD Model:

Technical Details:
PackagingTape & Reel (TR)
Package / Case132-VBGA
Mounting TypeSurface Mount
Memory Size512Gbit
Memory TypeNon-Volatile
Operating Temperature0°C ~ 70°C
Voltage - Supply2.6V ~ 3.6V
TechnologyFLASH - NAND (TLC)
Memory FormatFLASH
Supplier Device Package132-VBGA (12x18)
Part StatusActive
Write Cycle Time - Word, Page-
Memory InterfaceParallel
Memory Organization64G x 8
ProgrammableNot Verified
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