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The MT25QU02GCBB8E12-0AAT TR by Micron Technology Inc. is a high-performance memory component designed to cater to the rigorous demands of automotive applications, as validated by its compliance with the AEC-Q100 standard. This product falls under the memory category and is part of Micron’s versatile Automotive series, engineered specifically for reliability and durability across a wide range of operating conditions.

Featuring a compact 24-TBGA (Thin Ball Grid Array) package, the device offers an optimized footprint for sophisticated board designs, facilitating efficient space usage without compromising performance. The surface mount technology (SMT) enhances the product’s suitability for streamlined, high-volume manufacturing processes, ensuring a secure and reliable connection to the printed circuit board (PCB).

Operating over an expansive temperature range from -40°C to 105°C, the MT25QU02GCBB8E12-0AAT TR is engineered to withstand the extreme environmental conditions typically encountered in automotive settings, making it an ideal selection for embedded systems within vehicles. Its robust design and quality manufacturing underpin its utility in a broad array of automotive applications, from advanced driver-assistance systems (ADAS) to in-vehicle infotainment (IVI), and beyond.

Packaged on Tape & Reel (TR), this component is tailored for automated assembly processes, allowing for efficient and cost-effective bulk handling. The supplier device package, listed as 24-T-PBGA (6×8), further delineates its physical configuration, ensuring compatibility with a wide range of assembly techniques.

In summary, the MT25QU02GCBB8E12-0AAT TR memory component by Micron Technology Inc. stands out due to its robustness, operational efficiency, and suitability for high-reliability automotive applications, making it a trusted choice for industry professionals seeking to integrate dependable memory solutions into their automotive designs.

Additional information

Additional Information

Series: Automotive, AEC-Q100
RoHS Status: ROHS3 Compliant
Manufacturer Lead Time: 2 week(s)
Product Status: Active
Packaging: Tape & Reel (TR)


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Technical Details:
PackagingTape & Reel (TR)
Package / Case24-TBGA
Mounting TypeSurface Mount
Memory Size2Gbit
Memory TypeNon-Volatile
Operating Temperature-40°C ~ 105°C (TC)
Voltage - Supply1.7V ~ 2V
TechnologyFLASH - NOR
Clock Frequency133 MHz
Memory FormatFLASH
Supplier Device Package24-T-PBGA (6x8)
Part StatusActive
Write Cycle Time - Word, Page8ms, 2.8ms
Memory InterfaceSPI
Memory Organization256M x 8
ProgrammableNot Verified
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