Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
Introducing the AMD Kintex® UltraScale™ XCKU095-2FFVB1760I, a high-performance FPGA designed to meet the demanding needs of modern digital signal processing and high-speed connectivity applications. This component, belonging to the advanced Kintex® UltraScale™ series, is engineered to push the boundaries of technological capabilities, packaged conveniently in bulk for ease of integration into various projects.
The XCKU095-2FFVB1760I is encapsulated in a 1760-BBGA, FCBGA package, with a surface mount mounting type that ensures secure and reliable attachment to printed circuit boards. Operating across a wide temperature range from -40°C to 100°C (TJ), this FPGA demonstrates exceptional resilience under varying environmental conditions, making it suitable for deployment in harsh or demanding operational scenarios.
Boasting an impressive array of 1,176,000 logic elements/cells, alongside 67,200 LABs/CLBs, this component offers ample flexibility and capacity for complex circuit designs and applications. The massive 60,518,400 total RAM bits further enhance its capability to handle data-intensive tasks with efficiency.
With its extensive I/O count of 702, the XCKU095-2FFVB1760I facilitates a wide range of connectivity options, enabling intricate systems to communicate effectively without bottlenecks. The FPGA’s package, a 1760-FCBGA (42.5×42.5), allows for a compact yet powerful component that can fit into tight spaces without compromising on functionality or performance.
Currently in an active part status, this AMD FPGA finds application across a broad spectrum of industries, including telecommunications, aerospace, and defense, where its advanced features like high logic density and superior processing power can be leveraged to drive innovation and efficiency.
In conclusion, the Kintex® UltraScaleâ„¢ XCKU095-2FFVB1760I FPGA stands as a testament to AMD’s commitment to delivering cutting-edge, high-quality solutions for complex digital challenges, representing a reliable and capable choice for professionals seeking to create or enhance advanced electronic systems.
Download Free CAD Model:
Packaging | Bulk |
Package / Case | 1760-BBGA, FCBGA |
Mounting Type | Surface Mount |
Operating Temperature | -40°C ~ 100°C (TJ) |
Voltage - Supply | 0.922V ~ 0.979V |
Number of Logic Elements/Cells | 1176000 |
Supplier Device Package | 1760-FCBGA (42.5x42.5) |
Number of LABs/CLBs | 67200 |
Total RAM Bits | 60518400 |
Part Status | Active |
Number of I/O | 702 |
Programmable | Not Verified |
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