The XC6SLX75-3FGG484C, crafted by industry leader AMD, represents the pinnacle of FPGA technology under the renowned Spartan®-6 LX series. This component, highly esteemed for its delicate balance between performance and power efficiency, is designed in a 484-BBGA package with a surface mount configuration. Ensuring versatility and reliability, it operates optimally within a 0°C to 85°C temperature range, making it suitable for a broad spectrum of industrial applications.

Boasting 74,637 logic elements/cells and 5,831 LABs/CLBs, the XC6SLX75-3FGG484C is engineered to handle complex digital computations and signal processing tasks, underlining its utility in telecommunications, automotive systems, consumer electronics, and aerospace industries. The device’s architecture facilitates rapid prototyping and development for advanced digital systems, thereby accelerating time-to-market for new technologies.

With a substantial 2,832,384 total RAM bits available, this FPGA allows for the storage and manipulation of large datasets, supporting intricate algorithm execution without compromising system speed or integrity. Additionally, its 280 I/O ports offer expansive connectivity options, enabling seamless integration with a wide array of peripherals and other circuits.

Presented in a 484-FBGA (23×23) supplier device package and catalogued as an active component, the XC6SLX75-3FGG484C stands as a testament to AMD’s commitment to providing innovative solutions that meet the evolving demands of the technology sector. Its combination of high logic density, flexibility, and efficient power consumption makes it an ideal choice for designers and engineers seeking to push the boundaries of what’s possible in electronics design and application.