Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The Intel EP2A40B724C7 FPGA stands as a pivotal component within the APEX II series, prominently recognized for its advanced logic and processing capabilities tailored for high-demand applications. This FPGA is engineered with precision, encapsulated in a 724-BBGA, FCBGA package, optimized for surface mount technology, ensuring a seamless integration into a comprehensive array of system architectures. Offering an operating temperature range from 0°C to 85°C (TJ), it provides a robust solution for applications requiring reliability under varying environmental conditions.
Delving into its technical specifications, the EP2A40B724C7 boasts an impressive array of features:
– 38,400 logic elements/cells and 3,840 LABs/CLBs, enabling complex logic functions and high-density system designs.
– A substantial 655,360 total RAM bits, facilitating extensive data storage and manipulation for complex algorithms and processes.
– A vast 540 I/O pins provision, ensuring ample connectivity for peripherals and external devices, accommodating extensive interface requirements.
– This unit comes in a supplier device package of 724-BGA (35×35), meticulously designed for optimal performance and reliability.
Although marked as obsolete, the EP2A40B724C7 remains a sought-after component across various industries, particularly in telecommunications, data processing, military and defense, and aerospace sectors, where its reliability and performance under stringent conditions are unparalleled.
In summary, the Intel EP2A40B724C7 FPGA from the APEX II series embodies a sophisticated blend of high-density logic capacity, extensive memory, and connectivity options, making it an indispensable component for developing advanced technological solutions.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 724-BBGA, FCBGA |
Mounting Type | Surface Mount |
Number of Gates | 3000000 |
Operating Temperature | 0°C ~ 85°C (TJ) |
Voltage - Supply | 1.425V ~ 1.575V |
Number of Logic Elements/Cells | 38400 |
Supplier Device Package | 724-BGA (35x35) |
Number of LABs/CLBs | 3840 |
Total RAM Bits | 655360 |
Part Status | Obsolete |
Number of I/O | 540 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
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